Qazi Mashaal Khan, ESR 7 (ESEO), executed his physical secondment at Melexis Technologies (Tessenderlo, Belgium).
He worked together with their local EMC team for two months, from 31st May to 30th July 2021. His work’s main objective was to characterize a custom-designed Printed Circuit Board (PCB) with Transmission Line Pulse (TLP) & Direct Power Injection (DPI) testing using the state-of-the-art facilities at Melexis. In parallel, he investigated the effect of packaging, S-parameters, and Electrostatic discharge (ESD) protection structures on the performance of a test chip designed in 180 nm SOI (Silicon-on-Insulator) technology. This secondment lead to a fruitful research collaboration between Melexis and ESEO!
